MCIMX6Q5EYM12CE Overview
Packed in 624-LFBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 4 Core 32-Bit cores/Bus width. Extended operating temperature around -20°C~105°C TJ. It comes from the i.MX6Q series. This CPU is cored with a ARM® Cortex®-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. This CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6Q5EYM12CE Features
ARM® Cortex®-A9 Core

MCIMX6Q5EYM12CE Applications
There are a lot of NXP USA Inc.
MCIMX6Q5EYM12CE Microprocessor applications.

Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan

Factory Lead Time	14 Weeks
Package / Case	624-LFBGA, FCBGA
Operating Temperature	-20°C~105°C TJ
Packaging	Tray
Series	i.MX6Q
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.2GHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	4 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (4)
Additional Interfaces	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant