MCIMX6Q7CVT08AD OverviewThe microprocessor is convenient for international shipping since it is packaged in 624-FBGA, FCBGA. The packaging method Tray provides high reliability. There are 4 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~105°C TA should be understood. This is part of the i.MX6Q series. The CPU is powered by a ARM® Cortex®-A9 core. There are LPDDR2, LVDDR3, DDR3 RAM controllers on this CPU. This microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to better serve its users. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V. uPs/uCs/Peripheral ICs are a MICROPROCESSOR, RISC. To date, there have been 624 terminations. An architecture based on 64 bits is used. A maximum supply current of 1.5V is available. With a width of 64, this CPU has a wide external data bus. There is a clock frequency of 24MHz on the microprocessor.
MCIMX6Q7CVT08AD FeaturesARM® Cortex®-A9 Core
64-Bit Structure
MCIMX6Q7CVT08AD ApplicationsThere are a lot of NXP USA Inc.
MCIMX6Q7CVT08AD Microprocessor applications.
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Factory Lead Time | 15 Weeks |
Package / Case | 624-FBGA, FCBGA |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Series | i.MX6Q |
Published | 2002 |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 624 |
ECCN Code | 5A992 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | S-PBGA-B624 |
Supply Voltage-Max (Vsup) | 1.5V |
Supply Voltage-Min (Vsup) | 1.275V |
Speed | 800MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A9 |
Clock Frequency | 24MHz |
Bit Size | 64 |
Address Bus Width | 16 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 64 |
Format | FIXED POINT |
Integrated Cache | YES |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 4 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
SATA | SATA 3Gbps (1) |
Length | 21mm |
Height Seated (Max) | 2.16mm |
RoHS Status | ROHS3 Compliant |