MCIMX6S1AVM08AD OverviewWith a packing size of 624-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~125°C TJ. A i.MX6S series item. A ARM® Cortex®-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. 1.8V 2.5V 2.8V 3.3V is the CPU's I/O address. I would rate this as a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type. As a whole, there are 624 terminations. A maximum supply current of 1.5V can be achieved by the microprocessor. With a 32 external data bus width, this CPU has a wide data bus.
MCIMX6S1AVM08AD FeaturesARM® Cortex®-A9 Core
MCIMX6S1AVM08AD ApplicationsThere are a lot of NXP USA Inc.
MCIMX6S1AVM08AD Microprocessor applications.
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
| Factory Lead Time | 14 Weeks |
| Package / Case | 624-LFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Series | i.MX6S |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 624 |
| HTS Code | 8542.31.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B624 |
| Supply Voltage-Max (Vsup) | 1.5V |
| Supply Voltage-Min (Vsup) | 1.275V |
| Speed | 800MHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Core Processor | ARM® Cortex®-A9 |
| Address Bus Width | 16 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| External Data Bus Width | 32 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| Length | 21mm |
| Height Seated (Max) | 1.6mm |
| RoHS Status | ROHS3 Compliant |