MCIMX6S4AVM10AC OverviewThe embedded microprocessor ships overseas conveniently packed in 624-LFBGA. A high level of reliability is provided by using an advanced packaging method Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around -40°C~125°C TJ. i.MX6S is its series number. Core-wise, this CPU has a ARM® Cortex®-A9 processor. It has LPDDR2, LVDDR3, DDR3 RAM controllers. A CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 1.8V 2.5V 2.8V 3.3V. There is MICROPROCESSOR, RISC MICROPROCESSOR, RISC in the uPs, uCs, or peripheral ICs categories. A total of 624 terminations have been recorded. With a maximum supply current of 1.5V, it has a maximum power consumption.
MCIMX6S4AVM10AC FeaturesARM® Cortex®-A9 Core
MCIMX6S4AVM10AC ApplicationsThere are a lot of NXP USA Inc.
MCIMX6S4AVM10AC Microprocessor applications.
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-LFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Series | i.MX6S |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 624 |
| ECCN Code | 5A992 |
| HTS Code | 8542.31.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B624 |
| Supply Voltage-Max (Vsup) | 1.5V |
| Supply Voltage-Min (Vsup) | 1.4V |
| Speed | 1GHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| Length | 21mm |
| Height Seated (Max) | 1.6mm |
| RoHS Status | ROHS3 Compliant |
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