MCIMX6U4AVM08AC,NXP USA Inc. MCIMX6U4AVM08AC price,Integrated Circuits (ICs) MCIMX6U4AVM08AC Distributor,MCIMX6U4AVM08AC supplier
MCIMX6U4AVM08AC
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MCIMX6U4AVM08AC
    Part Number:KY-MCIMX6U4AVM08AC
    Mfr. Part No:MCIMX6U4AVM08AC
    Mfr.:NXP USA Inc.
    Stock:3009
    Description: 0.8mm ARM® Cortex®-A9 64-bit Microprocessor i.MX6DL Series 1.35V 624-LFBGA
    Data Sheet:MCIMX6U4AVM08AC Datasheet
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  • MCIMX6U4AVM08AC Overview
    Due to its 624-LFBGA packaging, it is convenient to ship overseas. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 2 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. From the i.MX6DL series. ARM® Cortex®-A9 is the processor core of this CPU. Memory controllers for this CPU are LPDDR2, LVDDR3, DDR3. Featuring CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces, this microprocessor can better serve you. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU. The type MICROPROCESSOR, RISC belongs to uPs/uCs/Peripheral ICs. Total terminations are 624. Using a 1.35V voltage supply, you should be able to operate the cpu microprocessor. 64-Bit is its architecture. Supply current is maximum at 1.5V. An external data bus width of 64 is available on this CPU. A clock frequency of 24MHz is used by the CPU microprocessor.
    MCIMX6U4AVM08AC Features
    ARM® Cortex®-A9 Core
    64-Bit Structure

    MCIMX6U4AVM08AC Applications
    There are a lot of NXP USA Inc.
    MCIMX6U4AVM08AC Microprocessor applications.

    Robots
    Radio
    Television
    Heater/Fan
    Calculator
    Kindle
    Christmas lights
    3D printers
    Washing machine
    Microwave ovens
    Factory Lead Time15 Weeks
    Package / Case624-LFBGA
    Surface MountYES
    Operating Temperature-40°C~125°C TJ
    PackagingTray
    Seriesi.MX6DL
    Published2002
    JESD-609 Codee1
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations624
    ECCN Code5A992
    Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
    HTS Code8542.31.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)260
    Supply Voltage1.35V
    Terminal Pitch0.8mm
    Time@Peak Reflow Temperature-Max (s)40
    JESD-30 CodeS-PBGA-B624
    Supply Voltage-Max (Vsup)1.5V
    Supply Voltage-Min (Vsup)1.275V
    Speed800MHz
    uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
    Core ProcessorARM® Cortex®-A9
    Clock Frequency24MHz
    Bit Size64
    Address Bus Width16
    Boundary ScanYES
    Low Power ModeYES
    External Data Bus Width64
    FormatFIXED POINT
    Integrated CacheYES
    Voltage - I/O1.8V 2.5V 2.8V 3.3V
    Ethernet10/100/1000Mbps (1)
    Number of Cores/Bus Width2 Core 32-Bit
    Graphics AccelerationYes
    RAM ControllersLPDDR2, LVDDR3, DDR3
    USBUSB 2.0 + PHY (4)
    Additional InterfacesCAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
    Co-Processors/DSPMultimedia; NEON™ SIMD
    Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
    Display & Interface ControllersKeypad, LCD
    Length21mm
    Height Seated (Max)1.6mm
    RoHS StatusROHS3 Compliant
    
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