MCIMX6X1CVK08AC OverviewThe microprocessor is convenient for international shipping since it is packaged in 400-LFBGA. The packaging method Tray provides high reliability. There are 2 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~105°C TA should be understood. This is part of the i.MX6SX series. The CPU is powered by a ARM® Cortex®-A9, ARM® Cortex®-M4 core. There are LPDDR2, LVDDR3, DDR3 RAM controllers on this CPU. This microprocessor features AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces to better serve its users. The CPU runs I/O at 1.8V 2.5V 2.8V 3.15V.
MCIMX6X1CVK08AC FeaturesARM® Cortex®-A9, ARM® Cortex®-M4 Core
MCIMX6X1CVK08AC ApplicationsThere are a lot of NXP USA Inc.
MCIMX6X1CVK08AC Microprocessor applications.
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Factory Lead Time | 15 Weeks |
Package / Case | 400-LFBGA |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Series | i.MX6SX |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
HTS Code | 8542.39.00.01 |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Speed | 200MHz, 800MHz |
Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 |
Voltage - I/O | 1.8V 2.5V 2.8V 3.15V |
Ethernet | 10/100/1000Mbps (2) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
Additional Interfaces | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ MPE |
Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
Display & Interface Controllers | Keypad, LCD |
RoHS Status | ROHS3 Compliant |