MCIMX6X2AVN08AC Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 400-LFBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 32-Bit. Recognize operating temperatures around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6SX series. The CPU is cored with a ARM® Cortex®-A9, ARM® Cortex®-M4 processor. The CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor features interfaces AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.15V.
MCIMX6X2AVN08AC Features
ARM® Cortex®-A9, ARM® Cortex®-M4 Core

MCIMX6X2AVN08AC Applications
There are a lot of NXP USA Inc.
MCIMX6X2AVN08AC Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	14 Weeks
Package / Case	400-LFBGA
Operating Temperature	-40°C~125°C TJ
Packaging	Tray
Series	i.MX6SX
Published	2017
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
HTS Code	8542.39.00.01
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	200MHz, 800MHz
Core Processor	ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O	1.8V 2.5V 2.8V 3.15V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces	AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ MPE
Security Features	A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers	Keypad, LCD
RoHS Status	ROHS3 Compliant