MCIMX6X3CVN08AC Overview
With a packing size of 400-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 2 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~105°C TA. A i.MX6SX series item. A ARM® Cortex®-A9, ARM® Cortex®-M4 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART. 1.8V 2.5V 2.8V 3.15V is the CPU's I/O address.
MCIMX6X3CVN08AC Features
ARM® Cortex®-A9, ARM® Cortex®-M4 Core

MCIMX6X3CVN08AC Applications
There are a lot of NXP USA Inc.
MCIMX6X3CVN08AC Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Factory Lead Time	15 Weeks
Package / Case	400-LFBGA
Operating Temperature	-40°C~105°C TA
Packaging	Tray
Series	i.MX6SX
Published	2017
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
HTS Code	8542.39.00.01
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	200MHz, 800MHz
Core Processor	ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O	1.8V 2.5V 2.8V 3.15V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces	AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ MPE
Security Features	A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers	Keypad, LCD
RoHS Status	ROHS3 Compliant