MCIMX6X4EVM10AC Overview
Packed in 529-LFBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 32-Bit cores/Bus width. Extended operating temperature around -20°C~105°C TJ. It comes from the i.MX6SX series. This CPU is cored with a ARM® Cortex®-A9, ARM® Cortex®-M4 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. To serve better this microprocessor features AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC interfaces. This CPU runs I/O at 1.8V 2.5V 2.8V 3.15V.
MCIMX6X4EVM10AC Features
ARM® Cortex®-A9, ARM® Cortex®-M4 Core

MCIMX6X4EVM10AC Applications
There are a lot of NXP USA Inc.
MCIMX6X4EVM10AC Microprocessor applications.

Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan

Factory Lead Time	15 Weeks
Package / Case	529-LFBGA
Operating Temperature	-20°C~105°C TJ
Packaging	Tray
Series	i.MX6SX
Published	2014
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	227MHz, 1GHz
Core Processor	ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O	1.8V 2.5V 2.8V 3.15V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces	AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Co-Processors/DSP	Multimedia; NEON™ MPE
Security Features	A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers	Keypad, LCD, LVDS
RoHS Status	ROHS3 Compliant