MPC8536EBVTAVLA Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 783-BBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~105°C TA. The cpu microprocessor belongs to the MPC85xx series. The CPU is cored with a PowerPC e500 processor. The CPU uses DDR2, DDR3 RAM controllers. This microprocessor features interfaces DUART, I2C, MMC/SD, PCI, SPI. In this CPU, I/O is set to 1.8V 2.5V 3.3V. The microprocessor can be searched for with MPC8536 if you are looking for variants. Suppliers offer a package of 783-FCPBGA (29x29).
MPC8536EBVTAVLA Features
PowerPC e500 Core

MPC8536EBVTAVLA Applications
There are a lot of NXP USA Inc.
MPC8536EBVTAVLA Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Package / Case	783-BBGA, FCBGA
Supplier Device Package	783-FCPBGA (29x29)
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2006
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8536
Speed	1.5GHz
Core Processor	PowerPC e500
Voltage - I/O	1.8V 2.5V 3.3V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR2, DDR3
USB	USB 2.0 (3)
Additional Interfaces	DUART, I2C, MMC/SD, PCI, SPI
Co-Processors/DSP	Security; SEC
Security Features	Cryptography
SATA	SATA 3Gbps (2)
RoHS Status	ROHS3 Compliant