MPC8560PX667LC Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 784-BBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C TA. In the MPC85xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR, SDRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, PCI, RapidIO, SPI, TDM, UART for better service. At 2.5V 3.3V, the CPU runs its I/O. Search MPC8560 for variants of the embedded microprocessor. It is offered by suppliers as a package 783-FCPBGA (29x29).
MPC8560PX667LC Features
PowerPC e500 Core

MPC8560PX667LC Applications
There are a lot of NXP USA Inc.
MPC8560PX667LC Microprocessor applications.

Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio

Package / Case	784-BBGA, FCBGA
Supplier Device Package	783-FCPBGA (29x29)
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2002
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8560
Speed	667MHz
Core Processor	PowerPC e500
Voltage - I/O	2.5V 3.3V
Ethernet	10/100/1000Mbps (2)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR, SDRAM
Additional Interfaces	I2C, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP	Communications; CPM
RoHS Status	Non-RoHS Compliant