MPC8569EVTANKGB Overview
Packed in 783-BBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~105°C TA. It comes from the MPC85xx series. This CPU is cored with a PowerPC e500v2 processor. This CPU uses DDR2, DDR3, SDRAM RAM controllers. To serve better this microprocessor features DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART interfaces. This CPU runs I/O at 1.0V 1.5V 1.8V 2.5V 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC8569. 783-FCPBGA (29x29) package is offered by suppliers.
MPC8569EVTANKGB Features
PowerPC e500v2 Core

MPC8569EVTANKGB Applications
There are a lot of NXP USA Inc.
MPC8569EVTANKGB Microprocessor applications.

Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan

Package / Case	783-BBGA, FCBGA
Supplier Device Package	783-FCPBGA (29x29)
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2010
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8569
Speed	800MHz
Core Processor	PowerPC e500v2
Voltage - I/O	1.0V 1.5V 1.8V 2.5V 3.3V
Ethernet	10/100Mbps (8), 1Gbps (4)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR2, DDR3, SDRAM
USB	USB 2.0 (1)
Additional Interfaces	DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP	Communications; QUICC Engine, Security; SEC
Security Features	Cryptography, Random Number Generator
RoHS Status	ROHS3 Compliant