MPC8569VTAUNLB Overview
With a packing size of 783-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~105°C TA. A MPC85xx series item. A PowerPC e500v2 processor is present in this CPU. The CPU contains DDR2, DDR3, SDRAM RAM controllers. This microprocessor is equipped with an interface of DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART. 1.0V 1.5V 1.8V 2.5V 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with MPC8569.
MPC8569VTAUNLB Features
PowerPC e500v2 Core

MPC8569VTAUNLB Applications
There are a lot of NXP USA Inc.
MPC8569VTAUNLB Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Package / Case	783-BBGA, FCBGA
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC85xx
Published	2010
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	MPC8569
Speed	1.333GHz
Core Processor	PowerPC e500v2
Voltage - I/O	1.0V 1.5V 1.8V 2.5V 3.3V
Ethernet	10/100Mbps (8), 1Gbps (4)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR2, DDR3, SDRAM
USB	USB 2.0 (1)
Additional Interfaces	DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP	Communications; QUICC Engine
RoHS Status	ROHS3 Compliant