OSD3358-512M-ICB,Octavo Systems LLC OSD3358-512M-ICB supplier,Octavo Systems LLC OSD3358-512M-ICB priceIntegrated Circuits (ICs)
OSD3358-512M-ICB,Octavo Systems LLC OSD3358-512M-ICB supplier,Octavo Systems LLC OSD3358-512M-ICB priceIntegrated Circuits (ICs)
OSD3358-512M-ICB
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OSD3358-512M-ICB
    Part Number:KY-OSD3358-512M-ICB
    Mfr. Part No:OSD3358-512M-ICB
    Mfr.:Octavo Systems LLC
    Stock:639
    Description: MPU Core ARM® Cortex®-A8, AM3358 1.06 x 1.06 27.0mmx27.0mm -40°C~85°C 4GB 400-BGA OSD335x 512MB 1GHz
    Data Sheet:OSD3358-512M-ICB Datasheet
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  • OSD3358-512M-ICB Description


    The OSD3358-512M-ICB C-SiP System-In-Package (SiP) is a self-contained computing system ideal to power the latest embedded applications. It integrates the powerful 1GHz Sitara™ ARM® Cortex®-A8 AM335x Processor from Texas Instruments, up to 1 Gigabyte (GB) of DDR3L memory, up to 16 Gigabytes (GB) of embedded Multimedia Card (eMMC) non-volatile memory, a low power, low jitter MEMs Oscillator, 4 Kilobytes (KB) EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, capacitors, and inductors into a single 27mm x 27mm easy to use IC package.



    OSD3358-512M-ICB Features


    TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS Oscillator, and passive components integrated into a single package

    Access to all* AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc.

    Up to 1GB DDR3

    Up to 16GB eMMC

    Low Power, Low Jitter MEMS Oscillator

    PWR In: AC Adapter, USB or Single cell (1S) Li-Ion / Li-Po Battery

    PWR Out: 1.8V, 3.3V and SYS

    Selectable I/O Voltage: 1.8V or 3.3V



    OSD3358-512M-ICB Applications


    Automotive 

    Body electronics & lighting 

    Industrial 

    Pro audio, video & signage 

    Personal electronics 

    Gaming


    Factory Lead Time8 Weeks
    Surface MountYES
    Operating Temperature-40°C~85°C
    SeriesOSD335x
    Size / Dimension1.06 x 1.06 27.0mmx27.0mm
    Part StatusActive
    Moisture Sensitivity Level (MSL)4 (72 Hours)
    Number of Terminations400
    Connector Type400-BGA
    Additional Feature24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)245
    Supply Voltage1.1V
    Terminal Pitch1.27mm
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    JESD-30 CodeS-PBGA-B400
    Speed1GHz
    RAM Size512MB
    uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
    Core ProcessorARM® Cortex®-A8, AM3358
    Address Bus Width16
    Boundary ScanYES
    Low Power ModeYES
    External Data Bus Width8
    FormatFIXED POINT
    Integrated CacheYES
    Module/Board TypeMPU Core
    Flash Size4GB
    Co-ProcessorNEON™ SIMD
    Length27mm
    Height Seated (Max)2.6mm
    Width27mm
    RoHS StatusROHS3 Compliant
    
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