SLE66R32PMCC8IXHSA1 Overview
In light of its outstanding performance, it is an ideal choice for Security.To save space, it is included in the Die package.In this case, it is mounted using the method of Surface Mount.In the package Tape & Reel (TR), it is included.Work should be performed at a temperature of -25°C~70°C.An electrical component such as this is included in the series my-d™ NFC.
SLE66R32PMCC8IXHSA1 Features
Die package
Mounting type of Surface Mount

SLE66R32PMCC8IXHSA1 Applications
There are a lot of Infineon Technologies
SLE66R32PMCC8IXHSA1 Microcontroller applications.

Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products
Digital cameras

Factory Lead Time	9 Weeks
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Wafer
Operating Temperature	-25°C~70°C
Packaging	Tape & Reel (TR)
Series	my-d™ NFC
Part Status	Discontinued
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Applications	Security
Interface	ISO14443-3 Type A, NFC Forum Type 2
RoHS Status	ROHS3 Compliant