SLE66R35RCZZZA1 Overview
In terms of performance, it is an excellent choice for Security.There is an option to purchase it in the Die package, which saves space.This is mounted using the Surface Mount method.There is a Bulk package available for it.Work should be done at -25°C~70°C.
SLE66R35RCZZZA1 Features
Die package
Mounting type of Surface Mount

SLE66R35RCZZZA1 Applications
There are a lot of Infineon Technologies
SLE66R35RCZZZA1 Microcontroller applications.

Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	26 Weeks
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Wafer
Operating Temperature	-25°C~70°C
Packaging	Bulk
Part Status	Discontinued
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Applications	Security
Interface	ISO14443-3 Type A
RoHS Status	ROHS3 Compliant