SVF532R2K1CMK4R Overview
With a packing size of 364-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 2 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~85°C TA. A Vybrid, VF5xxR series item. A ARM® Cortex®-A5 + Cortex®-M4 processor is present in this CPU. The CPU contains LPDDR2, DDR3, DRAM RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART. 3.3V is the CPU's I/O address. I would rate this as a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type.
SVF532R2K1CMK4R Features
ARM® Cortex®-A5 + Cortex®-M4 Core

SVF532R2K1CMK4R Applications
There are a lot of NXP USA Inc.
SVF532R2K1CMK4R Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Factory Lead Time	15 Weeks
Package / Case	364-LFBGA
Operating Temperature	-40°C~85°C TA
Packaging	Tape & Reel (TR)
Series	Vybrid, VF5xxR
Published	2012
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Speed	400MHz, 133MHz
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Core Processor	ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O	3.3V
Ethernet	10/100Mbps (2)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, DDR3, DRAM
USB	USB 2.0 OTG + PHY (1)
Additional Interfaces	CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP	Multimedia; NEON™ MPE
Security Features	ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers	DCU, GPU, LCD, VideoADC, VIU
RoHS Status	ROHS3 Compliant