TDA18267HB/C1,557 Overview
Saving board space is achieved with the 80-TFQFN Exposed Pad package.In order to pack telecommunications equipment, Tray is used.The mounting type of this telecom circuit is Surface Mount.There are 16 circuits in this telecom IC .
TDA18267HB/C1,557 Features
Available in the 80-TFQFN Exposed Pad package

TDA18267HB/C1,557 Applications
There are a lot of NXP USA Inc.
TDA18267HB/C1,557 Telecom applications.

SONET/SDH terminal
Add/Drop multiplexers (ADMs)
T1/E1/J1 add/drop multiplexers (MUX)
Channel Service Units (CSUs): T1/E1/J1
Fractional T1/E1/J1
BITS Timing
Digital Access Cross-connect System (DACs)
Digital Cross-connect Systems (DCS)
Frame Relay Switches and Access Devices (FRADS)
ISDN Primary Rate Interfaces (PRA)

Factory Lead Time	13 Weeks
Mounting Type	Surface Mount
Package / Case	80-TFQFN Exposed Pad
Packaging	Tray
Published	2016
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Power (Watts)	2.55W
Function	Transceiver
Number of Circuits	16
RoHS Status	ROHS3 Compliant