TE0808-04-06EG-1EE,Trenz Electronic GmbH TE0808-04-06EG-1EE price,Integrated Circuits (ICs) TE0808-04-06EG-1EE Distributor,TE0808-04-06EG-1EE supplier
TE0808-04-06EG-1EE,Trenz Electronic GmbH TE0808-04-06EG-1EE price,Integrated Circuits (ICs) TE0808-04-06EG-1EE Distributor,TE0808-04-06EG-1EE supplier
TE0808-04-06EG-1EE
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TE0808-04-06EG-1EE
    Part Number:KY-TE0808-04-06EG-1EE
    Mfr. Part No:TE0808-04-06EG-1EE
    Mfr.:Trenz Electronic GmbH
    Stock:7968
    Description: MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0808 4GB
    Data Sheet:TE0808-04-06EG-1EE Datasheet
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  • TE0808-04-06EG-1EE Overview
    A MPU Core-type board or module is used in this microcontroller.Processors with Zynq UltraScale+ XCZU6EG-1FFVC900E cores drive it.The microcontroller is set to 0°C~85°C by default, which is the default setting.Flash size on this MCU electronics is 128MB.Microprocessor chip is a type B2B connector.In the TE0808 series, this is one of the microcontrollers.The RAM size has been reduced to 4GB in order to ensure that the software runs normally.
    TE0808-04-06EG-1EE Features
    Core processor of Zynq UltraScale+ XCZU6EG-1FFVC900E
    Flash size of 128MB

    TE0808-04-06EG-1EE Applications
    There are a lot of Trenz Electronic GmbH
    TE0808-04-06EG-1EE Microcontroller, Microprocessor, FPGA Modules applications.

    Medical Devices
    Data Acquisition
    Industrial Control
    Process Control
    Process Monitoring
    Healthcare Monitoring
    Patient Monitoring
    IoT Secure Gateways
    Human Machine Interface
    Human Machine Control Panel
    Factory Lead Time12 Weeks
    Operating Temperature0°C~85°C
    SeriesTE0808
    Size / Dimension2.05 x 2.99 52mmx76mm
    Part StatusObsolete
    Moisture Sensitivity Level (MSL)Not Applicable
    Connector TypeB2B
    RAM Size4GB
    Core ProcessorZynq UltraScale+ XCZU6EG-1FFVC900E
    Module/Board TypeMPU Core
    Flash Size128MB
    
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