TE0808-04-09EG-1EE,Trenz Electronic GmbH TE0808-04-09EG-1EE price,Integrated Circuits (ICs) TE0808-04-09EG-1EE Distributor,TE0808-04-09EG-1EE supplier
TE0808-04-09EG-1EE,Trenz Electronic GmbH TE0808-04-09EG-1EE price,Integrated Circuits (ICs) TE0808-04-09EG-1EE Distributor,TE0808-04-09EG-1EE supplier
TE0808-04-09EG-1EE
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TE0808-04-09EG-1EE
    Part Number:KY-TE0808-04-09EG-1EE
    Mfr. Part No:TE0808-04-09EG-1EE
    Mfr.:Trenz Electronic GmbH
    Stock:3383
    Description: MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0808 4GB
    Data Sheet:TE0808-04-09EG-1EE Datasheet
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  • TE0808-04-09EG-1EE Overview
    MPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU9EG-1FFVC900E cores, microprocessor chip is powered by a processor.The default setting of the microcontroller is 0°C~85°C.MCU electronics 128MB has a flash size of 128MB.Connector type B2B refers to the type of connector.A member of the TE0808 Series, MCU chip has an LCD screen.Software runs normally with RAM size 4GB when the RAM size is reduced.
    TE0808-04-09EG-1EE Features
    Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
    Flash size of 128MB

    TE0808-04-09EG-1EE Applications
    There are a lot of Trenz Electronic GmbH
    TE0808-04-09EG-1EE Microcontroller, Microprocessor, FPGA Modules applications.

    Embedded Control Processing
    Embedded User Interfaces
    Test and Measurement
    Medical Devices
    Data Acquisition
    Industrial Control
    Process Control
    Process Monitoring
    Healthcare Monitoring
    Patient Monitoring
    Operating Temperature0°C~85°C
    SeriesTE0808
    Size / Dimension2.05 x 2.99 52mmx76mm
    Part StatusObsolete
    Moisture Sensitivity Level (MSL)1 (Unlimited)
    Connector TypeB2B
    RAM Size4GB
    Core ProcessorZynq UltraScale+ XCZU9EG-1FFVC900E
    Module/Board TypeMPU Core
    Flash Size128MB
    RoHS StatusROHS3 Compliant
    
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