TE0808-04-15EG-1EE Overview
A MPU Core module or board is used in the microcontroller.It has Zynq UltraScale+ XCZU15EG-1FFVC900E cores and is driven by a processor.Microcontrollers are configured by default to 0°C~85°C.MCU chips flash size is 128MB.B2B' stands for connector type.This MCUs belongs to the TE0808 Series of MCUs.A minimum RAM size of 2GB is set to enable the software to run normally.
TE0808-04-15EG-1EE Features
Core processor of Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash size of 128MB

TE0808-04-15EG-1EE Applications
There are a lot of Trenz Electronic GmbH
TE0808-04-15EG-1EE Microcontroller, Microprocessor, FPGA Modules applications.

Test and Measurement
Medical Devices
Data Acquisition
Industrial Control
Process Control
Process Monitoring
Healthcare Monitoring
Patient Monitoring
IoT Secure Gateways
Human Machine Interface

Factory Lead Time	14 Weeks
Operating Temperature	0°C~85°C
Series	TE0808
Size / Dimension	2.05 x 2.99 52mmx76mm
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	Not Applicable
Connector Type	B2B
RAM Size	2GB
Core Processor	Zynq UltraScale+ XCZU15EG-1FFVC900E
Module/Board Type	MPU Core
Flash Size	128MB