TE0820-03-03EG-1EL,Trenz Electronic GmbH TE0820-03-03EG-1EL supplier,Trenz Electronic GmbH TE0820-03-03EG-1EL priceIntegrated Circuits (ICs)
TE0820-03-03EG-1EL,Trenz Electronic GmbH TE0820-03-03EG-1EL supplier,Trenz Electronic GmbH TE0820-03-03EG-1EL priceIntegrated Circuits (ICs)
TE0820-03-03EG-1EL
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TE0820-03-03EG-1EL
    Part Number:KY-TE0820-03-03EG-1EL
    Mfr. Part No:TE0820-03-03EG-1EL
    Mfr.:Trenz Electronic GmbH
    Stock:1760
    Description: MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E 1.57 x 1.97 40mmx50mm 0°C~85°C 128MB B2B TE0820 2GB
    Data Sheet:TE0820-03-03EG-1EL Datasheet
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In Stock: 1760
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  • TE0820-03-03EG-1EL Overview
    MPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU3EG-1SFVC784E cores, microprocessor chip is powered by a processor.The default setting of the microcontroller is 0°C~85°C.MCU electronics 128MB has a flash size of 128MB.Connector type B2B refers to the type of connector.A member of the TE0820 Series, MCU chip has an LCD screen.Software runs normally with RAM size 2GB when the RAM size is reduced.
    TE0820-03-03EG-1EL Features
    Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
    Flash size of 128MB

    TE0820-03-03EG-1EL Applications
    There are a lot of Trenz Electronic GmbH
    TE0820-03-03EG-1EL Microcontroller, Microprocessor, FPGA Modules applications.

    Embedded Control Processing
    Embedded User Interfaces
    Test and Measurement
    Medical Devices
    Data Acquisition
    Industrial Control
    Process Control
    Process Monitoring
    Healthcare Monitoring
    Patient Monitoring
    Operating Temperature0°C~85°C
    SeriesTE0820
    Size / Dimension1.57 x 1.97 40mmx50mm
    Part StatusObsolete
    Moisture Sensitivity Level (MSL)1 (Unlimited)
    Connector TypeB2B
    RAM Size2GB
    Core ProcessorZynq UltraScale+ XCZU3EG-1SFVC784E
    Module/Board TypeMPU Core
    Flash Size128MB
    
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