TE0820-03-03EG-1EL OverviewMPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU3EG-1SFVC784E cores, microprocessor chip is powered by a processor.The default setting of the microcontroller is 0°C~85°C.MCU electronics 128MB has a flash size of 128MB.Connector type B2B refers to the type of connector.A member of the TE0820 Series, MCU chip has an LCD screen.Software runs normally with RAM size 2GB when the RAM size is reduced.
TE0820-03-03EG-1EL FeaturesCore processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB
TE0820-03-03EG-1EL ApplicationsThere are a lot of Trenz Electronic GmbH
TE0820-03-03EG-1EL Microcontroller, Microprocessor, FPGA Modules applications.
Embedded Control Processing
Embedded User Interfaces
Test and Measurement
Medical Devices
Data Acquisition
Industrial Control
Process Control
Process Monitoring
Healthcare Monitoring
Patient Monitoring
| Operating Temperature | 0°C~85°C |
| Series | TE0820 |
| Size / Dimension | 1.57 x 1.97 40mmx50mm |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Connector Type | B2B |
| RAM Size | 2GB |
| Core Processor | Zynq UltraScale+ XCZU3EG-1SFVC784E |
| Module/Board Type | MPU Core |
| Flash Size | 128MB |