TE0890-01-25-1C Overview
The module or board type of the microcontroller is FPGA Core.Microprocessor chip is driven by a processor with Xilinx Spartan-7 XC7S25 cores.0°C~70°C is the default setting for the microcontroller.The MCU electronics's size of flash is 64Mbit.Dual-pinout DIP-40 or 50mil 80 pin connector is the connector type.MCU chip belongs to the TE0890 Series.The MCU chip operates in 100MHz speed.
TE0890-01-25-1C Features
Core processor of Xilinx Spartan-7 XC7S25
Flash size of 64Mbit
Speed of 100MHz

TE0890-01-25-1C Applications
There are a lot of Trenz Electronic GmbH
TE0890-01-25-1C Microcontroller, Microprocessor, FPGA Modules applications.

Industrial Automation
Industrial Instrumentation
Embedded Control Processing
Embedded User Interfaces
Test and Measurement
Medical Devices
Data Acquisition
Industrial Control
Process Control
Process Monitoring

Factory Lead Time	12 Weeks
Operating Temperature	0°C~70°C
Series	TE0890
Size / Dimension	1.06 x 2.05 27.0mmx52.0mm
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Connector Type	Dual-pinout DIP-40 or 50mil 80 pin connector
Speed	100MHz
Core Processor	Xilinx Spartan-7 XC7S25
Module/Board Type	FPGA Core
Flash Size	64Mbit
RoHS Status	ROHS3 Compliant