XC3S5000-4FGG900C,Xilinx Inc. XC3S5000-4FGG900C supplier,Xilinx Inc. XC3S5000-4FGG900C priceIntegrated Circuits (ICs)
XC3S5000-4FGG900C,Xilinx Inc. XC3S5000-4FGG900C supplier,Xilinx Inc. XC3S5000-4FGG900C priceIntegrated Circuits (ICs)
XC3S5000-4FGG900C
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XC3S5000-4FGG900C
    Part Number:KY-XC3S5000-4FGG900C
    Mfr. Part No:XC3S5000-4FGG900C
    Mfr.:Xilinx Inc.
    Stock:1436
    Description: 1.2V V 2.6mm mm FPGAs Spartan®-3 Series 900-BBGA 1mm mm 900
    Data Sheet:XC3S5000-4FGG900C Datasheet
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  • XC3S5000-4FGG900C Overview
    Fpga chips is supplied in the 900-BBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 633 I/Os for transferring data in a more coherent manner. There are 74880 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3 seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 633 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 900 terminations. The RAM bits that this device offer is 1916928. Its base part number XC3S5000 can be used to find related parts. The RAM si234kBe of this FPGA module reaches 234kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 900 pins. This FPGA is built as an array of 8320 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. Its basic building block contains 5000000 gates. Fpga semiconductor is equipped wfpga semiconductorh 900 pin count. Typically, fpga semiconductor uses a crystal oscillating at 630MHz .
    XC3S5000-4FGG900C Features
    633 I/Os
    Up to 1916928 RAM bits
    900 LABs/CLBs

    XC3S5000-4FGG900C Applications
    There are a lot of Xilinx Inc.
    XC3S5000-4FGG900C FPGAs applications.

    Digital signal processing
    Bioinformatics
    Device controllers
    Software-defined radio
    Random logic
    ASIC prototyping
    Medical imaging
    Computer hardware emulation
    Integrating multiple SPLDs
    Voice recognition
    Factory Lead Time10 Weeks
    MountSurface Mount
    Mounting TypeSurface Mount
    Package / Case900-BBGA
    Number of Pins900
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesSpartan®-3
    Published2009
    JESD-609 Codee1
    Pbfree Codeyes
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations900
    ECCN Code3A991.D
    Voltage - Supply1.14V~1.26V
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)250
    Supply Voltage1.2V
    Terminal Pitch1mm
    Time@Peak Reflow Temperature-Max (s)30
    Base Part NumberXC3S5000
    Pin Count900
    Number of Outputs633
    Qualification StatusNot Qualified
    Operating Supply Voltage1.2V
    Power Supplies1.21.2/3.32.5V
    Number of I/O633
    RAM Size234kB
    Clock Frequency630MHz
    Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
    Number of Logic Elements/Cells74880
    Total RAM Bits1916928
    Number of Gates5000000
    Number of LABs/CLBs8320
    Speed Grade4
    Combinatorial Delay of a CLB-Max0.61 ns
    Length31mm
    Height Seated (Max)2.6mm
    Width31mm
    RoHS StatusROHS3 Compliant
    
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