XC3S5000-4FGG900C OverviewFpga chips is supplied in the 900-BBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 633 I/Os for transferring data in a more coherent manner. There are 74880 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3 seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 633 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 900 terminations. The RAM bits that this device offer is 1916928. Its base part number XC3S5000 can be used to find related parts. The RAM si234kBe of this FPGA module reaches 234kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 900 pins. This FPGA is built as an array of 8320 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. Its basic building block contains 5000000 gates. Fpga semiconductor is equipped wfpga semiconductorh 900 pin count. Typically, fpga semiconductor uses a crystal oscillating at 630MHz .
XC3S5000-4FGG900C Features633 I/Os
Up to 1916928 RAM bits
900 LABs/CLBs
XC3S5000-4FGG900C ApplicationsThere are a lot of Xilinx Inc.
XC3S5000-4FGG900C FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
| Factory Lead Time | 10 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Spartan®-3 |
| Published | 2009 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S5000 |
| Pin Count | 900 |
| Number of Outputs | 633 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 633 |
| RAM Size | 234kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 74880 |
| Total RAM Bits | 1916928 |
| Number of Gates | 5000000 |
| Number of LABs/CLBs | 8320 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Length | 31mm |
| Height Seated (Max) | 2.6mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |