This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 484-LFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Artix™-7 FPGA, 74K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Bulk package.This SoC part contains a total of 130 I/Os in total.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XC7Z015-2CL485I System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

Factory Lead Time	10 Weeks
Package / Case	484-LFBGA, CSPBGA
Supplier Device Package	484-CSPBGA (19x19)
Operating Temperature	-40°C~100°C TJ
Packaging	Bulk
Series	Zynq®-7000
Published	2010
Part Status	Active
Moisture Sensitivity Level (MSL)	2A (4 Weeks)
Number of I/O	130
Speed	766MHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Artix™-7 FPGA, 74K Logic Cells
RoHS Status	Non-RoHS Compliant