This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 275K Logic Cells.Housed in the state-of-art Bulk package.130 I/Os in total are included in this SoC part.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XC7Z035-2FFV676E System On Chip (SoC) applications.

Automotive gateway
Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors

Factory Lead Time	11 Weeks
Package / Case	676-BBGA, FCBGA
Supplier Device Package	676-FCBGA (27x27)
Operating Temperature	0°C~100°C TJ
Packaging	Bulk
Series	Zynq®-7000
Published	2010
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of I/O	130
Speed	800MHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Kintex™-7 FPGA, 275K Logic Cells
RoHS Status	ROHS3 Compliant