XCKU040-3FFVA1156E OverviewFpga chips is supplied in the 1156-BBGA, FCBGA package. Fpga chips is programmed wFpga chipsh 520 I/Os for transferring data in a more coherent manner. There are 530250 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.970V~1.030V. It is a type of FPGA belonging to the Kintex® UltraScale™ seies. The operating temperature should be kept at 0°C~100°C TJ when operating. There are 520 outputs incorporated in this device. This FPGA model is contained in Bulk for space saving. The RAM bits that this device offer is 21606000. The RAM si2.6MBe of this FPGA module reaches 2.6MB to ensure normal operation of the program. This FPGA is built as an array of 30300 LABs/CLBs. Fpga electronics operates from a 1V power supply. 1920 CLBs are basic modules used for its architecture. Fpga semiconductor operates at a frequency of 741MHz to deliver high efficiency. The RAM memory is adopted for storing data and avoiding resource conflicts. The packing method fpga circuit adapts is TRAY, in order to sufpga circuit most design purposes in the industry.
XCKU040-3FFVA1156E Features520 I/Os
Up to 21606000 RAM bits
Operating from a frequency of 741MHz
XCKU040-3FFVA1156E ApplicationsThere are a lot of Xilinx Inc.
XCKU040-3FFVA1156E FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
| Factory Lead Time | 10 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 1156-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Series | Kintex® UltraScale™ |
| Published | 2012 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Packing Method | TRAY |
| Voltage - Supply | 0.970V~1.030V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 741MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B1156 |
| Number of Outputs | 520 |
| Qualification Status | Not Qualified |
| Power Supplies | 1V |
| Number of I/O | 520 |
| RAM Size | 2.6MB |
| Memory Type | RAM |
| Number of Inputs | 520 |
| Organization | 1920 CLBS |
| Number of Logic Elements/Cells | 530250 |
| Total RAM Bits | 21606000 |
| Number of LABs/CLBs | 30300 |
| Speed Grade | 3 |
| Number of CLBs | 1920 |
| Max Junction Temperature (Tj) | 100°C |
| Height | 3.42mm |
| RoHS Status | ROHS3 Compliant |