XCKU085-2FLVA1517I OverviewFpga chips is supplied in the 1517-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 624 I/Os for transferring data in a more coherent manner. There are 1088325 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 0.95V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.922V~0.979V. It is a type of FPGA belonging to the Kintex® UltraScale™ seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 624 outputs incorporated in this device. This FPGA model is contained in Bulk for space saving. The RAM bits that this device offer is 58265600. The RAM si7.1MBe of this FPGA module reaches 7.1MB to ensure normal operation of the program. This FPGA is built as an array of 62190 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 950mV, designers can fully make use of its flexibility. Fpga electronics operates from a 0.95V power supply. There are 995040 registers used to store and transfer data. 4100 CLBs are basic modules used for its architecture. The packing method fpga circuit adapts is TRAY, in order to sufpga circuit most design purposes in the industry.
XCKU085-2FLVA1517I Features624 I/Os
Up to 58265600 RAM bits
995040 registers
XCKU085-2FLVA1517I ApplicationsThere are a lot of Xilinx Inc.
XCKU085-2FLVA1517I FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 1517-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Bulk |
| Series | Kintex® UltraScale™ |
| Published | 2012 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| ECCN Code | 3A001.A.7.B |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Packing Method | TRAY |
| Voltage - Supply | 0.922V~0.979V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.95V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B1517 |
| Number of Outputs | 624 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 950mV |
| Power Supplies | 0.95V |
| Number of I/O | 624 |
| RAM Size | 7.1MB |
| Number of Inputs | 624 |
| Organization | 4100 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 1088325 |
| Total RAM Bits | 58265600 |
| Number of LABs/CLBs | 62190 |
| Speed Grade | 2 |
| Number of Registers | 995040 |
| Number of CLBs | 4100 |
| Length | 40mm |
| Height Seated (Max) | 4.09mm |
| Width | 40mm |
| RoHS Status | ROHS3 Compliant |