This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is used to build this SoC.Its package is 484-BFBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC CG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 82.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.Having 484 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU2CG-L1SBVA484I System On Chip (SoC) applications.

Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports

Factory Lead Time	11 Weeks
Package / Case	484-BFBGA, FCBGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Zynq® UltraScale+™ MPSoC CG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of Terminations	484
Additional Feature	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code	8542.31.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	0.72V
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	R-PBGA-B484
Supply Voltage-Max (Vsup)	0.742V
Supply Voltage-Min (Vsup)	0.698V
Number of I/O	82
Speed	500MHz, 1.2GHz
RAM Size	256KB
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status	ROHS3 Compliant