XCZU3EG-2SFVC784E,Xilinx Inc. XCZU3EG-2SFVC784E supplier,Xilinx Inc. XCZU3EG-2SFVC784E priceIntegrated Circuits (ICs)
XCZU3EG-2SFVC784E,Xilinx Inc. XCZU3EG-2SFVC784E supplier,Xilinx Inc. XCZU3EG-2SFVC784E priceIntegrated Circuits (ICs)
XCZU3EG-2SFVC784E
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XCZU3EG-2SFVC784E
    Part Number:KY-XCZU3EG-2SFVC784E
    Mfr. Part No:XCZU3EG-2SFVC784E
    Mfr.:Xilinx Inc.
    Stock:4161
    Description: 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 252 I/O
    Data Sheet:XCZU3EG-2SFVC784E Datasheet
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  • This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
    A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 784-BFBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC EG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.252 I/Os are available in this SoC part.
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
    256KB RAM.
    Built on MCU, FPGA.

    There are a lot of Xilinx Inc.
    XCZU3EG-2SFVC784E System On Chip (SoC) applications.

    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Fitness
    Factory Lead Time11 Weeks
    Package / Case784-BFBGA, FCBGA
    Operating Temperature0°C~100°C TJ
    PackagingTray
    SeriesZynq® UltraScale+™ MPSoC EG
    Published2016
    Pbfree Codeyes
    Part StatusActive
    Moisture Sensitivity Level (MSL)4 (72 Hours)
    HTS Code8542.31.00.01
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    Number of I/O252
    Speed533MHz, 600MHz, 1.3GHz
    RAM Size256KB
    Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    PeripheralsDMA, WDT
    ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    ArchitectureMCU, FPGA
    Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
    RoHS StatusROHS3 Compliant
    
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