XCZU4EG-1SFVC784I,Xilinx Inc. XCZU4EG-1SFVC784I price,Integrated Circuits (ICs) XCZU4EG-1SFVC784I Distributor,XCZU4EG-1SFVC784I supplier
XCZU4EG-1SFVC784I,Xilinx Inc. XCZU4EG-1SFVC784I price,Integrated Circuits (ICs) XCZU4EG-1SFVC784I Distributor,XCZU4EG-1SFVC784I supplier
XCZU4EG-1SFVC784I
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XCZU4EG-1SFVC784I
    Part Number:KY-XCZU4EG-1SFVC784I
    Mfr. Part No:XCZU4EG-1SFVC784I
    Mfr.:Xilinx Inc.
    Stock:9620
    Description: -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 252 I/O
    Data Sheet:XCZU4EG-1SFVC784I Datasheet
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  • This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.There is a 784-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC EG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 252 inputs and outputs.
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
    256KB RAM.
    Built on MCU, FPGA.

    There are a lot of Xilinx Inc.
    XCZU4EG-1SFVC784I System On Chip (SoC) applications.

    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Fitness
    Healthcare
    Medical
    Remote control
    Factory Lead Time11 Weeks
    Package / Case784-BFBGA, FCBGA
    Operating Temperature-40°C~100°C TJ
    PackagingTray
    SeriesZynq® UltraScale+™ MPSoC EG
    Published2016
    Part StatusActive
    Moisture Sensitivity Level (MSL)4 (72 Hours)
    HTS Code8542.31.00.01
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    Number of I/O252
    Speed500MHz, 600MHz, 1.2GHz
    RAM Size256KB
    Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    PeripheralsDMA, WDT
    ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    ArchitectureMCU, FPGA
    Primary AttributesZynq®UltraScale+™ FPGA, 192K+ Logic Cells
    RoHS StatusROHS3 Compliant
    
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