This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC EV is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 252 I/Os in total.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU4EV-L2SFVC784E System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

Factory Lead Time	11 Weeks
Package / Case	784-BFBGA, FCBGA
Supplier Device Package	784-FCBGA (23x23)
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Series	Zynq® UltraScale+™ MPSoC EV
Published	2016
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of I/O	252
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status	ROHS3 Compliant