XR2211ACP-F OverviewA 14-DIP (0.300, 7.62mm) package is used to reduce board space requirements.A Tube-packing method is used to pack telecommunications equipment.A Through Hole-mount is used for mounting the telecom circuit.Providing 4.5V~20V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A 0°C~70°C-temperature setting offers reliable performance.An electric current of 5mA is supplied to telecom equipment .
XR2211ACP-F FeaturesAvailable in the 14-DIP (0.300, 7.62mm) package
XR2211ACP-F ApplicationsThere are a lot of MaxLinear, Inc.
XR2211ACP-F Telecom applications.
Fractional T1/E1/J1
BITS Timing
Digital Access Cross-connect System (DACs)
Digital Cross-connect Systems (DCS)
Frame Relay Switches and Access Devices (FRADS)
ISDN Primary Rate Interfaces (PRA)
PBXs channel bank
PCM channel bank
T3 channelized access concentrators
M13 MUX
| Mounting Type | Through Hole |
| Package / Case | 14-DIP (0.300, 7.62mm) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Power (Watts) | 900mW |
| Voltage - Supply | 4.5V~20V |
| Function | FSK Demodulator, Tone Decoder |
| Current - Supply | 5mA |