This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 780-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Arria 10 SX series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 320K Logic Elements together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 360 I/Os.For safe operation, it is advisable to utilize a power supply with 0.9V voltage.In the SoCs wireless, high voltages above 0.93V are considered dangerous and should not be used.In order to run it, it must be fed by at least 0.87V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 780 terminations in total.In order for this SoC chip to work properly, you can have 360 outputs.This system on chip SoC requires 0.9V power supply at all.The SoC chip is equipped with 360 inputs.In logic system on chips, there are 320000 logic cells.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel
10AS032E3F29E2SG System On Chip (SoC) applications.

Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical

Factory Lead Time	8 Weeks
Package / Case	780-BBGA, FCBGA
Surface Mount	YES
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Series	Arria 10 SX
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	780
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	0.9V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B780
Number of Outputs	360
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	0.93V
Power Supplies	0.9V
Supply Voltage-Min (Vsup)	0.87V
Number of I/O	360
Speed	1.5GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Number of Inputs	360
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 320K Logic Elements
Number of Logic Cells	320000
Length	29mm
Height Seated (Max)	3.35mm
Width	29mm
RoHS Status	RoHS Compliant