This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) are used in the construction of this SoC.Manufacturer assigns package FBGA-530 to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MPU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C ~ 100°C (TJ).Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells is important.In total, this SoC part has 82 I/Os.A flashing - appears on it.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MPU, FPGA.
- extended flash.

There are a lot of Xilinx
XCZU3EG-2UBVA530E System On Chip (SoC) applications.

Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances

Package / Case	FBGA-530
Supplier Device Package	530-FCBGA (16x9.5)
Mounting Style	SMD/SMT
Number of I/Os	82 I/O
Minimum Operating Temperature	0 C
Maximum Operating Temperature	+ 100 C
Package	Tray
Mfr	AMD Xilinx
Product Status	Active
Operating Temperature	0°C ~ 100°C (TJ)
Series	Zynq® UltraScale+™ MPSoC EG
Operating Supply Voltage	850 mV
Number of I/O	82
Speed	533MHz, 600MHz, 1.333GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MPU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Number of Cores	7 Core
Flash Size	-