2309NZ-1HPGGI8 Overview
A 16-TSSOP (0.173, 4.40mm Width) case is used for packaging. A Tape & Reel (TR) is used to package it. Under normal circumstances, 133.33MHz is the maximum value. A mount of Surface Mount has been applied to it. This electronic component falls under the classification of Fanout Buffer (Distribution). Temperature -40°C~85°C is recommended for reliable performance. With a 3V~3.6VV power source, it should work. It belongs to the family IDT2309-1.
2309NZ-1HPGGI8 Features
The operating temperature of -40°C~85°C degrees

2309NZ-1HPGGI8 Applications
There are a lot of Renesas Electronics America Inc.
2309NZ-1HPGGI8 Clock Buffers & Drivers applications.

Medical instruments
Furniture
Machine made
Clock signal duplication
Clock signal format conversion
Clock signal level shifting
High performance communication system
Data center
Cloud computing
Network

Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	16-TSSOP (0.173, 4.40mm Width)
Operating Temperature	-40°C~85°C
Packaging	Tape & Reel (TR)
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Fanout Buffer (Distribution)
Voltage - Supply	3V~3.6V
Base Part Number	IDT2309-1
Number of Circuits	1
Frequency (Max)	133.33MHz
Input	LVTTL
Ratio - Input:Output	1:9
Differential - Input:Output	No/No
RoHS Status	ROHS3 Compliant