This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 896-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Cyclone® V SE is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines FPGA - 85K Logic Elements and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 181, FPGA - 288 I/Os in total.A power supply with a 1.1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.13V.As a minimum, the power supply of the SoC system on a chip needs to be 1.07V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 896 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 288 outputs.In order to use system on chip, you will need a power supply of 1.11.2/3.32.5V.This SoC chip is equipped with 288 inputs for the user to choose from.The logic system on chips contain 85000 logic cells.5CSEMA5 can help you find system on chips with similar specs and purposes.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
64KB RAM.
Built on MCU, FPGA.

There are a lot of Intel
5CSEMA5F31C7N System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

Factory Lead Time	8 Weeks
Package / Case	896-BGA
Surface Mount	YES
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	Cyclone® V SE
Published	2018
JESD-609 Code	e1
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	896
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.1V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	5CSEMA5
JESD-30 Code	S-PBGA-B896
Number of Outputs	288
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.13V
Power Supplies	1.11.2/3.32.5V
Supply Voltage-Min (Vsup)	1.07V
Number of I/O	MCU - 181, FPGA - 288
Speed	800MHz
RAM Size	64KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Number of Inputs	288
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 85K Logic Elements
Number of Logic Cells	85000
Length	31mm
Height Seated (Max)	2mm
Width	31mm
RoHS Status	RoHS Compliant