This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 1156-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EV series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 360 I/Os.It is recommended to use a 0.72V power supply.In the SoCs wireless, voltages above 0.742V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.698V.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc. XCZU7EV-L1FFVC1156I System On Chip (SoC) applications.
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
| Factory Lead Time | 11 Weeks |
| Package / Case | 1156-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Published | 2016 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B1156 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 360 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |