XCZU7EV-L1FFVC1156I,Xilinx Inc. XCZU7EV-L1FFVC1156I supplier,Xilinx Inc. XCZU7EV-L1FFVC1156I priceIntegrated Circuits (ICs)
XCZU7EV-L1FFVC1156I,Xilinx Inc. XCZU7EV-L1FFVC1156I supplier,Xilinx Inc. XCZU7EV-L1FFVC1156I priceIntegrated Circuits (ICs)
XCZU7EV-L1FFVC1156I
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XCZU7EV-L1FFVC1156I
    Part Number:KY-XCZU7EV-L1FFVC1156I
    Mfr. Part No:XCZU7EV-L1FFVC1156I
    Mfr.:Xilinx Inc.
    Stock:13703
    Description: -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 360 I/O 0.72V
    Data Sheet:XCZU7EV-L1FFVC1156I Datasheet
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  • This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
    On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 1156-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EV series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 360 I/Os.It is recommended to use a 0.72V power supply.In the SoCs wireless, voltages above 0.742V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.698V.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

    There are a lot of Xilinx Inc.
    XCZU7EV-L1FFVC1156I System On Chip (SoC) applications.

    High-end PLC
    Vending machines
    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Factory Lead Time11 Weeks
    Package / Case1156-BBGA, FCBGA
    Surface MountYES
    Operating Temperature-40°C~100°C TJ
    PackagingTray
    SeriesZynq® UltraScale+™ MPSoC EV
    Published2016
    Part StatusActive
    Moisture Sensitivity Level (MSL)4 (72 Hours)
    Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    HTS Code8542.31.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Supply Voltage0.72V
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    JESD-30 CodeR-PBGA-B1156
    Supply Voltage-Max (Vsup)0.742V
    Supply Voltage-Min (Vsup)0.698V
    Number of I/O360
    Speed500MHz, 600MHz, 1.2GHz
    RAM Size256KB
    uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
    Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    PeripheralsDMA, WDT
    ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    ArchitectureMCU, FPGA
    Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
    RoHS StatusROHS3 Compliant
    
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