This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 288-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 31, FPGA - 78 I/Os are included in this SoC part.A 1.5V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.575V.At least 1.425V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 288 terminations, which makes system on a chip possible.A SoC chip with 78 outputs is available.A power supply of 1.51.82.53.3V is required.A SoC chip with 78 inputs is available.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-CSG288I System On Chip (SoC) applications.

Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics

Factory Lead Time	12 Weeks
Package / Case	288-TFBGA, CSPBGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®
JESD-609 Code	e1
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	288
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Supply Voltage	1.5V
Terminal Pitch	0.5mm
Frequency	80MHz
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	A2F500M3G
JESD-30 Code	S-PBGA-B288
Number of Outputs	78
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.575V
Power Supplies	1.51.82.53.3V
Supply Voltage-Min (Vsup)	1.425V
Interface	EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O	MCU - 31, FPGA - 78
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture	MCU, FPGA
Number of Inputs	78
Organization	11520 CLBS, 500000 GATES
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Core Architecture	ARM
Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates	500000
Flash Size	512KB
Length	11mm
Height Seated (Max)	1.05mm
Width	11mm
RoHS Status	RoHS Compliant