CY8C6347BZI-BLD53T Overview
As a result, it is available in the 116-WFBGA package.Surface Mount is the way to mount it.Application Specific Microcontroller is available in the Reel package.Application Specific Microcontroller is equipped wApplication Specific Microcontrollerh a ARM® Cortex®-M0+, ARM® Cortex®-M4F core processor.When working, it is recommended that the temperature be kept at -40°C ~ 85°C (TA).Memory type FLASH is used for program memory.78 I/Os are present on the device.In the CY8C63xx series, this electrical component is found.Using an oscillator type of External, Internal, it works.
CY8C6347BZI-BLD53T Features
116-WFBGA package
Mounting type of Surface Mount

CY8C6347BZI-BLD53T Applications
There are a lot of Infineon Technologies
CY8C6347BZI-BLD53T Microcontroller applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Mounting Type	Surface Mount
Package / Case	116-WFBGA
Supplier Device Package	116-BGA (5.2x6.4)
RoHS	Details
Tradename	PSoC 6
Package	Tape & Reel (TR)
Mfr	Infineon Technologies
Data Converters	A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Product Status	Active
Packaging	Reel
Series	CY8C63xx
Operating Temperature	-40°C ~ 85°C (TA)
Oscillator Type	External, Internal
Number of I/O	78
Speed	100MHz, 150MHz
RAM Size	288K x 8
Voltage - Supply (Vcc/Vdd)	1.7V ~ 3.6V
Core Processor	ARM® Cortex®-M0+, ARM® Cortex®-M4F
Peripherals	Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I²S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Program Memory Type	FLASH
Core Size	32-Bit Dual-Core
Program Memory Size	1MB (1M x 8)
Connectivity	FIFO, I²C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
EEPROM Size	-