LS1026AXN8P1A Overview
The embedded microprocessor has been packed in 780-FBGA, FCBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 2 Core 64-Bit cores and width 2 Core 64-Bit busses is used. Understand how the operating temperature around -40°C~105°C is determined. This is a member of the QorIQ® Layerscape series. With a core count of ARM® Cortex®-A72, this CPU is multicore. A CPU with this architecture uses DDR4 RAM controllers. Overall, there are 780 terminations. The microprocessor should be turned on and run with a voltage supply of 1V volts. There is a maximum supply current of 1.03V in this microprocessor. Its external data bus width is 64. There are 76 input/output (I/O) channels on the CPU that transfer data.
LS1026AXN8P1A Features
ARM® Cortex®-A72 Core
76 I/Os

LS1026AXN8P1A Applications
There are a lot of NXP USA Inc.
LS1026AXN8P1A Microprocessor applications.

Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products

Factory Lead Time	18 Weeks
Package / Case	780-FBGA, FCBGA
Surface Mount	YES
Operating Temperature	-40°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2016
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	780
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	250
Supply Voltage	1V
Terminal Pitch	0.8mm
Time@Peak Reflow Temperature-Max (s)	30
JESD-30 Code	S-PBGA-B780
Supply Voltage-Max (Vsup)	1.03V
Supply Voltage-Min (Vsup)	0.97V
Number of I/O	76
Speed	1.4GHz
Core Processor	ARM® Cortex®-A72
Address Bus Width	14
Boundary Scan	YES
External Data Bus Width	64
Ethernet	10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR4
USB	USB 3.0 (3) + PHY
Bus Compatibility	I2C, PCI, SPI, UART, USB
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
Length	23mm
Height Seated (Max)	2.61mm
RoHS Status	ROHS3 Compliant