This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 5K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 161 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 256 terminations, which is great for system on a chip.There are 161 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 161 inputs available for use.Logic system on chips consist of 6060 logic cells.There is a flash of 128KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S005-1VF256I System On Chip (SoC) applications.

High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices

Lifecycle Status	IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time	10 Weeks
Package / Case	256-LFBGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®2
Published	2015
JESD-609 Code	e0
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Terminal Finish	Tin/Lead (Sn/Pb)
Additional Feature	LG-MIN, WD-MIN
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	0.8mm
Reach Compliance Code	not_compliant
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B256
Number of Outputs	161
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.26V
Power Supplies	1.2V
Supply Voltage-Min (Vsup)	1.14V
Number of I/O	161
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Number of Inputs	161
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 5K Logic Modules
Number of Logic Cells	6060
Flash Size	128KB
Length	14mm
Height Seated (Max)	1.56mm
Width	14mm
RoHS Status	Non-RoHS Compliant