M2S010TS-VF256,Microsemi Corporation M2S010TS-VF256 price,Integrated Circuits (ICs) M2S010TS-VF256 Distributor,M2S010TS-VF256 supplier
M2S010TS-VF256,Microsemi Corporation M2S010TS-VF256 price,Integrated Circuits (ICs) M2S010TS-VF256 Distributor,M2S010TS-VF256 supplier
M2S010TS-VF256
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M2S010TS-VF256
    Part Number:KY-M2S010TS-VF256
    Mfr. Part No:M2S010TS-VF256
    Mfr.:Microsemi Corporation
    Stock:13228
    Description: 256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
    Data Sheet:M2S010TS-VF256 Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 10K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 138 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 256 terminations, which is great for system on a chip.There are 138 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 138 inputs available for use.Logic system on chips consist of 12084 logic cells.There is a flash of 256KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    LG-MIN, WD-MIN

    There are a lot of Microsemi Corporation
    M2S010TS-VF256 System On Chip (SoC) applications.

    High-end PLC
    Vending machines
    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Factory Lead Time10 Weeks
    Package / Case256-LFBGA
    Surface MountYES
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesSmartFusion®2
    JESD-609 Codee0
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations256
    Terminal FinishTin/Lead (Sn/Pb)
    Additional FeatureLG-MIN, WD-MIN
    HTS Code8542.39.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Supply Voltage1.2V
    Terminal Pitch0.8mm
    Reach Compliance Codenot_compliant
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    JESD-30 CodeS-PBGA-B256
    Number of Outputs138
    Qualification StatusNot Qualified
    Supply Voltage-Max (Vsup)1.26V
    Power Supplies1.2V
    Supply Voltage-Min (Vsup)1.14V
    Number of I/O138
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Number of Inputs138
    Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
    Primary AttributesFPGA - 10K Logic Modules
    Number of Logic Cells12084
    Flash Size256KB
    Length14mm
    Height Seated (Max)1.56mm
    Width14mm
    RoHS StatusNon-RoHS Compliant
    
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