This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 233 I/Os.As for its flash size, it is 256KB.By searching M2S010, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 484 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.There is a design maximum operating temperature 85°C specified for this SoC system on chip.It has a maximum supply voltage of 1.26V rated for it.As long as it receives at least 1.14V of power, then it is working.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S010-FG484 System On Chip (SoC) applications.

Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical

Lifecycle Status	IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time	11 Weeks
Package / Case	484-BGA
Number of Pins	484
Supplier Device Package	484-FPBGA (23x23)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®2
Published	2009
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	85°C
Min Operating Temperature	0°C
Frequency	166MHz
Base Part Number	M2S010
Operating Supply Voltage	1.2V
Interface	CAN, Ethernet, I2C, SPI, UART, USART, USB
Max Supply Voltage	1.26V
Min Supply Voltage	1.14V
Memory Size	256kB
Number of I/O	233
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Data Rate	667 Mbps
Architecture	MCU, FPGA
Number of Logic Elements/Cells	12084
Core Architecture	ARM
Max Frequency	400MHz
Number of Logic Blocks (LABs)	1007
Primary Attributes	FPGA - 10K Logic Modules
Flash Size	256KB
RoHS Status	Non-RoHS Compliant