XCZU17EG-1FFVE1924I,Xilinx Inc. XCZU17EG-1FFVE1924I price,Integrated Circuits (ICs) XCZU17EG-1FFVE1924I Distributor,XCZU17EG-1FFVE1924I supplier
XCZU17EG-1FFVE1924I,Xilinx Inc. XCZU17EG-1FFVE1924I price,Integrated Circuits (ICs) XCZU17EG-1FFVE1924I Distributor,XCZU17EG-1FFVE1924I supplier
XCZU17EG-1FFVE1924I
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XCZU17EG-1FFVE1924I
    Part Number:KY-XCZU17EG-1FFVE1924I
    Mfr. Part No:XCZU17EG-1FFVE1924I
    Mfr.:Xilinx Inc.
    Stock:12416
    Description: -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 668 I/O
    Data Sheet:XCZU17EG-1FFVE1924I Datasheet
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  • This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 1924-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 926K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 668 I/Os.
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
    256KB RAM.
    Built on MCU, FPGA.

    There are a lot of Xilinx Inc.
    XCZU17EG-1FFVE1924I System On Chip (SoC) applications.

    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Fitness
    Healthcare
    Medical
    Factory Lead Time11 Weeks
    Package / Case1924-BBGA, FCBGA
    Operating Temperature-40°C~100°C TJ
    PackagingTray
    SeriesZynq® UltraScale+™ MPSoC EG
    Published2016
    Part StatusActive
    Moisture Sensitivity Level (MSL)4 (72 Hours)
    HTS Code8542.31.00.01
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    Number of I/O668
    Speed500MHz, 600MHz, 1.2GHz
    RAM Size256KB
    Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    PeripheralsDMA, WDT
    ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    ArchitectureMCU, FPGA
    Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
    RoHS StatusROHS3 Compliant
    
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