M2S025-1FGG484,Microsemi Corporation M2S025-1FGG484 price,Integrated Circuits (ICs) M2S025-1FGG484 Distributor,M2S025-1FGG484 supplier
M2S025-1FGG484,Microsemi Corporation M2S025-1FGG484 price,Integrated Circuits (ICs) M2S025-1FGG484 Distributor,M2S025-1FGG484 supplier
M2S025-1FGG484
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M2S025-1FGG484
    Part Number:KY-M2S025-1FGG484
    Mfr. Part No:M2S025-1FGG484
    Mfr.:Microsemi Corporation
    Stock:10787
    Description: 0°C~85°C TJ M2S025 System On Chip SmartFusion®2 Series 267 I/O
    Data Sheet:M2S025-1FGG484 Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines FPGA - 25K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 267 I/Os in total.This flash has a size of 256KB.M2S025 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 166MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.Starting the SoC computing is as simple as setting 0°C.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    Core Architecture: ARM

    There are a lot of Microsemi Corporation
    M2S025-1FGG484 System On Chip (SoC) applications.

    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Fitness
    Healthcare
    Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
    Factory Lead Time8 Weeks
    Package / Case484-BGA
    Supplier Device Package484-FPBGA (23x23)
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesSmartFusion®2
    Published2009
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Max Operating Temperature85°C
    Min Operating Temperature0°C
    Frequency166MHz
    Base Part NumberM2S025
    InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
    Number of I/O267
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Core ArchitectureARM
    Primary AttributesFPGA - 25K Logic Modules
    Flash Size256KB
    RoHS StatusRoHS Compliant
    
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