This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 180.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 325 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 180 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 180 inputs is available to the user.86316 logic cells are included in logic system on chips.There is a flash of 512KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S090TS-1FCS325 System On Chip (SoC) applications.

Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports

Lifecycle Status	IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time	10 Weeks
Package / Case	325-TFBGA, CSPBGA
Surface Mount	YES
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®2
Published	2015
JESD-609 Code	e0
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	325
Terminal Finish	Tin/Lead (Sn/Pb)
Additional Feature	LG-MIN, WD-MIN
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	0.5mm
Reach Compliance Code	not_compliant
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	R-PBGA-B325
Number of Outputs	180
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.26V
Power Supplies	1.2V
Supply Voltage-Min (Vsup)	1.14V
Number of I/O	180
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Number of Inputs	180
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 90K Logic Modules
Number of Logic Cells	86316
Flash Size	512KB
Length	13.5mm
Height Seated (Max)	1.16mm
Width	11mm
RoHS Status	Non-RoHS Compliant