This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search M2S090S for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S090S-1FG484I System On Chip (SoC) applications.

Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics

Package / Case	484-BGA
Supplier Device Package	484-FPBGA (23x23)
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®2
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	100°C
Min Operating Temperature	-40°C
Frequency	166MHz
Base Part Number	M2S090S
Interface	CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O	267
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Core Architecture	ARM
Primary Attributes	FPGA - 90K Logic Modules
Flash Size	512KB
RoHS Status	Non-RoHS Compliant