This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 484-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 90K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 267 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 484 terminations, which is great for system on a chip.There are 267 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 267 inputs available for use.Logic system on chips consist of 86316 logic cells.There is a flash of 512KB on it.M2S090T will give you system on chips with similar specifications and purposes.It operates at a frequency of 166MHz.In terms of core architecture, the SoC meaning relies on ARM.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S090T-1FG484 System On Chip (SoC) applications.

High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices

Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time	10 Weeks
Package / Case	484-BGA
Surface Mount	YES
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®2
Published	2009
JESD-609 Code	e0
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	484
Terminal Finish	Tin/Lead (Sn/Pb)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	1mm
Reach Compliance Code	not_compliant
Frequency	166MHz
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	M2S090T
JESD-30 Code	S-PBGA-B484
Number of Outputs	267
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.26V
Power Supplies	1.2V
Supply Voltage-Min (Vsup)	1.14V
Interface	CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O	267
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Number of Inputs	267
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Core Architecture	ARM
Primary Attributes	FPGA - 90K Logic Modules
Number of Logic Cells	86316
Flash Size	512KB
Length	23mm
Height Seated (Max)	2.44mm
Width	23mm
RoHS Status	Non-RoHS Compliant