This SoC is built on ARM® Cortex®-M3 core processor(s).
A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.267 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 484 terminations in total and that really benefits system on a chip.You can have 267 user outputs for this SoC chip.System on chip requires 1.2V power supplies.267 inputs are available on the SoC chip.Logic system on chips features 86316 logic cells.It has a 512KB flash.You can get system on chips with similar specs and purposes by searching M2S090T.The wireless SoC works at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S090T-1FG484I System On Chip (SoC) applications.

Automotive gateway
Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors

Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time	10 Weeks
Package / Case	484-BGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®2
Published	2009
JESD-609 Code	e0
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	484
Terminal Finish	Tin/Lead (Sn/Pb)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	1mm
Reach Compliance Code	not_compliant
Frequency	166MHz
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	M2S090T
JESD-30 Code	S-PBGA-B484
Number of Outputs	267
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.26V
Power Supplies	1.2V
Supply Voltage-Min (Vsup)	1.14V
Interface	CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O	267
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Number of Inputs	267
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Core Architecture	ARM
Primary Attributes	FPGA - 90K Logic Modules
Number of Logic Cells	86316
Flash Size	512KB
Length	23mm
Height Seated (Max)	2.44mm
Width	23mm
RoHS Status	Non-RoHS Compliant